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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility 1 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility 1
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Description

(Wiley - IEEE) 1st Edition 

by Lih-Tyng Hwang (Author), Tzyy-Sheng Jason Horng (Author) 

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

  • Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
  • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
  • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
  • Provides chapter-wise review questions and powerpoint slides as teaching tools

Details

Year:
2018
Pages:
450
Language:
English
Format:
PDF
Size:
11.5 MB
ISBN-10:
1119289645
ISBN-13:
978-1119289647
ASIN:
B07BYSK7GT
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