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Adhesion in Microelectronics
Description
(Adhesion and Adhesives: Fundamental and Applied Aspects) 1st Edition
by K. L. Mittal (Author), Tanweer Ahsan (Author)
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of materials as it pertains to adhesion
- Surface cleaning as it pertains to adhesion
- Ways to improve adhesion
- Unraveling of interfacial interactions using an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to various substrates
- Adhesion of thin films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of different dielectric materials
- Delamination and reliability issues in packaged devices
- Interface mechanics and crack propagation
- Adhesion measurement of thin films and coatings
Details
Year:
2014
Pages:
355
Language:
English
Format:
PDF
Size:
4.5 MB
ISBN-10:
1118831330
ISBN-13:
978-1118831335
ASIN:
B00N2R9CXO